IP Roundup | GenomeWeb

IP Roundup

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BioScale of Cambridge, Mass., has received US Patent No. 7,814,652, "Method of making through-hole vias in a substrate." The patent claims a system for assembling resonant sensors. The system includes a sensor module where a sensor is formed on a conductive substrate with a cavity formed on one surface. According to the patent, the substrate has conductive vias extending from the cavity to a second surface of the substrate. A ceramic-made housing assembly accommodates the sensor, and an electronic component, such as an amplifier, is mounted on the housing.

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