Helicos to Pay Down $10M from Loan | GenomeWeb

NEW YORK (GenomeWeb News) – Helicos BioSciences disclosed in a regulatory filing today that it will make a $10 million pre-payment on a $20 million loan on or before Dec. 31.

The pre-payment is part of a third amendment to Helicos’ loan and security agreement signed in December 2007 with certain lenders and GE Capital.

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