Intel's Path to Exascale Computing Very, Very Hot

Intel research fellow says that, despite the heat, the path to exascale computing is in stacking chips.

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Can fractal-shaped 3D

Can fractal-shaped 3D chips---Menger sponge or the like---maximize heat dissipation:transistor? The lung is designed something like this (I'm a mathematical/systems biologist).

You correctly note the

You correctly note the immense heat problem presented by massively parallel computing. INTEL's Hybrid Memory Cube not only does not solve the heat problem for the CPUs, but presents very large costs.

We've taken a different approach: https://www.venraytechnology.com/economics_of_cpu_in_DRAM2.pdf

Russell Fish
russell.fish@venraytechnology.com